Product data sheetva-Q-mic
Characteristics | |
va-Q-mic is an evacuated thermal insulation panel with extremely low initial thermal conductivity. The core of va-Q-mic comprises an open cell micro fleece. The qualified and not hamrful core material is sealed in a ultra low permeation gas barrier film under vacuum. The barrier film ensures that the va-Q-mic contains low vacuum level for a nessarary service time. In general va-Q-mic is produced rectangular shape and other shapes such as triangel, trapezium, cornet cut etc. are available on request. |  |
Applications | |
va-Q-mic is especially developed for an applications, where extremely little space is available. The service life of va-Q-mic depends very much on environmental conditions i.e. applied part of temperature and humidity. For example va-Q-mic can be used a single-use thermal transport packaging. Please discuss your application with va-Q-tec AG. |  |
Advantage
- Excellent initial insulation properties
- Extremely low thickness
Product data
| Surface color | Silver |
| Geometry | Rectangular shape |
| Density | 220 kg/m³ |
| Thermal conductivity | 0.0028 to 0.0035 W/(mK) |
| Temperature stability | -70 °C to +60 °C |
| Thermal shcok resistance | Not sensitive to heat & cold shock in the given temperature range |
| Humidity stability | 0 % to 60 % |
| Internal gas pressure | < 1 mbar (at delivery) |
| Maximum dimension (L x W) | 1300 mm x 1000 mm |
| Thickness | 14 mm and 20 mm |
| Size tolerance | |
| • 0 to 500 mm | ± 3 mm |
| • 501 to 1000 mm | ± 5 mm |
| • 1001 to 1300 mm | ± 7 mm |
| U-value | 0.25 W/(m²K) (at 14 mm thickness) |
| Mass per area | 3.0 kg/m² (at 14 mm thickness) |
| Compressive strength | approx. 74 kPa (at 10% compression) |
| Service life | approx. 5 years (depends on application and climate conditions) |
* For 14 mm thickness, if a flat edge is required, the flanges are refolded onto the main surface of panel.
All figures are intended as a guide and should not be used for preparing specifications.
All figures are intended as a guide and should not be used for preparing specifications.